GKG-PT-250×30×0.25mm英文名: GKG 250mm刮刀片中文名: GKG 250mm刮刀片韩文名: 日文名: 材质: 暂无信息规格: 250×30×0.25mm单位: 相关文档相关设备IPC 7525B-2011 中文版 模板设计指导(钢网设计指南).pdf[25.6mil]2.00mm[78.7mil]0.60mm[23.6mil]1.95mm[76.8mil]0.15~0.25mm[5.91~9.84mil]2.4~4.0 0.92~1.53 3号QFP 0.65mm[25.6mil]0.35mm[13.8mil]1.50mm[59.1mil]0.30mm[11.8mil]1.45mm[57.1mil]0.15~0.175mm[5.91~6.89mil ]1.7~2.0 0.71~0.83 3号QFP 0.50mm[19.7mil]0.30mm[11.8mil]1.25mm[49.2mil]0.25mm[9.84mil]1.20mm[47.2mil]0.125 ~0.15mm[4.92~5.91mil]1.7~2.0 0.69~0.83 3号QFP 0.40mm[15.7mil]0.25mm[9.84mil]1.25mm[49.2mil]0.20mm[7.87mil /A 0.4mm[9.84mil]0.45mm[15.7mil]0.23mm[9.06mil]0.35mm[13.8mil]0.075~0.125mm[2.95~4.92mil]/A 0.56~0.93标准文献合众手机板钢网制作规范 V1.3.pdf6 / 12 11 排阻 排容 (1) 1、 宽按照 IC规范开,不内切; 2、 长内外扩名扩 0.15mm,如上下两引脚的距离大于 0.5mm,则内扩至距离为 0.5mm。 宽度按照 1:1 开口 13 音频 BGA 0.50pitch 的 9 球 BGA 开 方孔按照0.3mm*0.3mm,倒角 R=0.08 mm ,四周开孔方式按照箭头方向外移 0.05mm,中间焊盘保持不变 14 CPU/FLASH BGA 开方形孔,倒角 0.05mm,(除 6253) 0.50pitch 开 0.30mm, 0.65pitch 开 0.35mm, 0.80pitch 开 0.45mm, 1.00pitch 开 0.52mm 15 MT6253 外 围锡球 焊盘 开 0.275MM 方 孔 倒角0.075MM,中间接地开 0.55MM 方形倒角 0.125MM, 数量为 8*8PCS, 17 屏蔽罩 整体加 0.3mm(拐 脚 处 宽 度 整 体 加0.4mm)并按间隔 3mm 架桥 0.65mm(屏蔽罩之间保持 0.65mm),外加后与各焊盘之间保持在 0.4mm 以上。标准文献IPC-7525 钢网设计规则.pdf]1.7-2.0 0.71-0.83QFP 0.50mm [19.7mil] 0.30mm [11.8mil] 1.25mm [49.2mil]0.25mm [9.84mil]1.20mm [47.2mil ]0.125-0.15mm[4.92-5.91mil]1.7-2.0 0.69-0.83QFP 0.40mm [15.7mil] 0.25mm [9.84mil] 1.25mm [49.2mil]0.20mm -1.000201 N/A 0.25mm [9.84mil] 0.40mm [15.7mil]0.23mm [9.06mil]0.35mm [13.8mil]0.075-0.125mm[2.95-3.94mil ]N/A 0.66-0.89BGA 1.25mm [49.2mil] CIR 0.80mm [31.5mil] CIR 0.80mm [31.5mil]CIR 0.75mm [29.5mil]CIR 0.75mm BGA1 0.50mm [19.7mil] CIR 0.30mm [11.8mil] CIR 0.30mm [11.8mil]SQ 0.28mm [11.0mil]SQ 0.28mm [11.0mil中文 标准文献合众手机板钢网制作规范 V1.3.pdf38 滤波器-1 此 类 五 个 焊 盘 尺 寸 一 般 按 照0.325mm*0.25mm 开网,开方形孔,倒角 0.10mm,安全距离保持 0.2MM。 39 滤波器-2 两边共 8 个引脚(如果原始长度达到0.45MM 以上的,长度就 1:1 开,宽度开 0.2MM,如果长度不到 0.35mm 的加长 0.35MM,宽度 0.2MM,接地的两个引脚内切 ,保留长度至 0.4MM,宽开0.21MM 靠外侧开孔。 40 电池连接器 1 此类焊盘开网时,将固定焊盘内切 70%防锡珠处理,外加 30%以防止假焊,长度方向各切 15%;3 个功能引脚焊盘内切 20%处理,外加 30%。 43 屏蔽框焊盘与屏蔽框焊盘 此类屏蔽框焊盘与屏蔽框焊盘相互间距少于 0.65mm 时,开孔保持在 0.65mm 或以上,防止此处屏蔽框变形,影响张力。标准文献182050 User manual.pdfAct Rel Movement 0 ± 0.45mm 0.025mm ± 2mmRear X Act Rel Movement 0 ± 0.85mm 0.025mm ± 2mmAct Y Rel Movement 0 ± 0.25mm 0.025mm ± 2mmFront X Act Position Front X Rough Align Value± 0.45mm 0.025mm ± 9mmRear X Act Position Rear X RoughAlign Value± 0.85mm 0.025mm ± 9mmAct Y Position Y Rough Align Value± 0.25mm 0.025mm ± 9mmPVP Result 80 ± 20% 5% ± 50%Front Print Speed ProductParameter± 0.5mm 0.25mm ± 5mmRear Print Speed ProductParameter ± 0.5mm 0.25mm ± 5mmParameter Nominal DefaultTolerancesIncrementSizeToleranceRange操作手册 英文Horizon UserManualV6.pdfParameter Nominal DefaultTolerancesIncrementSizeToleranceRangeCycle Time 30 ± 2 seconds 0.1 seconds ± 0.85mm 0.025mm ± 2mmAct Y Rel Movement 0 ± 0.25 0.025mm ± 2mmFront X Act Position Front X RoughAlign Value± 0.45mm 0.025mm ± 9mmRear X Act Position Rear X RoughAlign Value± 0.85mm 0.025mm ± 9mmAct Y Position Y Rough AlignValue± 0.25mm 0.025mm ± 9mmPVP Result 80 ± 20 % 5 % ± 50 %Front Print Speed Product Parameter ± 0.5mm 0.25mm ± 5mmRear Print Speed Product Parameter ± 0.5mm 0.25mm ± 5mm1.112 User Manual Software操作手册Dek-265GSX-User-Manual.pdf.pdfParameter Nominal DefaultTolerancesIncrementSizeToleranceRangeCycle Time 30 ± 2 seconds 0.1 seconds ± 0.85mm 0.025mm ± 2mmAct Y Rel Movement 0 ± 0.25 0.025mm ± 2mmFront X Act Position Front X RoughAlign Value± 0.45mm 0.025mm ± 9mmRear X Act Position Rear X RoughAlign Value± 0.85mm 0.025mm ± 9mmAct Y Position Y Rough AlignValue± 0.25mm 0.025mm ± 9mmPVP Result 80 ± 20 % 5 % ± 50 %Front Print Speed Product Parameter ± 0.5mm 0.25mm ± 5mmRear Print Speed Product Parameter ± 0.5mm 0.25mm ± 5mm1.112 User Manual SoftwareDEK INFINITY USER MANUAL.pdf.pdf1 arcsec ± 100 arcsecPre Print Board Stretch 0 ± 0.1mm 0.01mm ± 1mmPre Fid 1 X Align Deviation 0 ± 0.0625mm ± 1mmFront X Act Rel Movement 0 ± 0.45mm 0.025mm ± 2mmRear X Act Rel Movement 0 ± 0.85mm 0.025mm ± 2mmAct Y Rel Movement 0 ± 0.25mm 0.025mm ± 2mmFront X Act Position Front X Rough Align Value± 0.45mm 0.025mm ± 0.25mm 0.025mm ± 9mmPVP Result 80 ± 20% 5% ± 50%Front Print Speed ProductParameter± 0.5mm 0.25mm ± 5mmRear Print Speed ProductParameter ± 0.5mm 0.25mm ± 5mmParameter Nominal DefaultTolerancesIncrementSizeToleranceRangePrinter 600 Machine Programming.pdf1 arcsec ± 100 arcsecPre Print Board Stretch 0 ± 0.1mm 0.01mm ± 1mmPre Fid 1 X Align Deviation 0 ± 0.0625mm ± 1mmFront X Act Rel Movement 0 ± 0.45mm 0.025mm ± 2mmRear X Act Rel Movement 0 ± 0.85mm 0.025mm ± 2mmAct Y Rel Movement 0 ± 0.25mm 0.025mm ± 2mmFront X Act Position Front X Rough Align Value± 0.45mm 0.025mm ± 0.25mm 0.025mm ± 9mmPVP Result 80 ± 20% 5% ± 50%Front Print Speed ProductParameter± 0.5mm 0.25mm ± 5mmRear Print Speed ProductParameter ± 0.5mm 0.25mm ± 5mmParameter Nominal DefaultTolerancesIncrementSizeToleranceRange操作手册FX3_动作说明书.pdf例如,2125R时,元件下面和Scan高度的间隙为0.15mm 时,检测为倾斜吸附状态,因而被退出。 激光Scan高度 此时因为固定位置有问题,需要进行纠正。 〔2125R〕时 正常吸附横向吸附间隙中央激光Scan高度 上述元件尺寸计算的错误值是1.25× t =0.75mm,如果激光对准正常吸附和横跳起吸附间隙的中央时,则为 ( t+W)/2=(0.6+1. 25)/2=0.925mm。 〔1608C〕时 t=0.8mm、W=0.8mm 芯片跳起检测高度为 H=(0.8+0.8)/2=0.8mm。 注) 在历来的机型中,短边 0.25mm 以上、不足 0.45mm 的元件系数是 1.1,但由于会产生芯片跳起的过频测出错误,所以改变为 1.2。同时,0.25mm 以下的元件系数设为 1.25。中文 标准文献H2000GKG 凯格 锡膏印刷机 H2000