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SEHO 选择性焊锡机 PowerSelective

设备尺寸(W*D*H): Small:2170x2110mm/Large:2570x2210mm

设备重量: To be check

电源要求: 230/400V 50Hz 3P+N+PE/3x208V 60Hz 4P

气源要求: R 1/4pipe min.6bar

设备简介:SEHO PowerSelective is featured with an outstanding modular machine construction which ensures highest flexibility. The basic system can ideally be configurated to meet different specific production requirements and it provides the opportunity to be upgraded step by step at a later date to suit subsequent production developments. 展开更多

设备参数
设备文档
配件清单
Gripper guuidance system
Item
Spec
3 axis double portal system for installation of different gripper tools
Standard
Repeatability
+/-0.1mm
Rotating function
0~270 degree
Soldering angle setup by tilting the gripper
0~12 degree
Conveyor variants
Item
Spec
Single and dual lane conveyor systems for stand-along operaion
Option
Single and dual lane conveyor systems for inline operation
Option
Max.board/carrier dimension
500x500mm
Micro drop jet fluxer
Item
Spec
Wetting width on PCB
2~4mm
Automatic level control with capacitive sensor
Option
Automatic flux quantity monitoring
Option
Multiple nozzle heads
Option
Flux types,alcohol or water based
Up to 5% solids content
Preheating
Item
Spec
Quartz heading cassette integrated or in separate preheat module
Option
Pyrometer for aradient-controlled preheat process
Option
Convection heating cassette in separate preheat module
Option
Top side heating installed in the carrier gripper or in the preheat area
Option
Soldering units
Item
Spec
Soldering units suitable for lead-free applications
Standard
Max.solder pot temerature
Up to 350℃
Quick change solder nozzles and multi-nozzle tools
Option
Automatic wave height control
Option
Automatic solder level control and solder wire supply
Option
Software and process control features
Online teach system with camera and offline teach program
Standard
Process visualization
Option
Automatic position correction and automatic z height correction
Option
Intelligent tool management
Option
Integrated selective brush system
Option
AOI system for solder joint inspecion
Option
Connection
Item
Spec
Nitrogen supply
R 1/4,,min 4bar
Nitrogen consumption(Single nozzle)
approx.1.5~2.0m³/h
Required nitrogen quality
5.0 recommended
Exhaust
1x500~600m³/h
Comment
• High mix - high volume. • Modular system which ideally fits into each production concept: for inline or stand-alone operation and flexible lean production concepts. • Upgradable any time to minimize cycle times or to increase the production volume. • Wide field of application: for multiwave soldering, miniwave or even for conventional wave soldering. • Multiple soldering units and additional processes may be integrated into one machine. • Wetted or non-wetted solder nozzles can be used as well as innovative multi-nozzle tools. • High precision portal axis system which provides maximum flexibility. • The rotating and tilting function of the gripper allows ideal peel-off to minimize solder bridges. • Solder waves with touchless wave height control and controlled nitrogen inertion, for best possible soldering results and highest reliability. • Maximum machine availability due to quick change nozzles and product change-over or maintenance „on-the-fly“. • User-friendly operating interface and easy-to-handle teaching function, online or offline. • 100 % automatic process control with integrated AOI system, flux quantity monitoring and many more innovative functions. • Minimum maintenance requirements and ideal accessibility. • For board or carrier dimensions up to 500 x 500 mm [19.68" x 19.68"].
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