电脑光学贴片QX250i™2D自动光学检查机
设备尺寸(W*D*H): 1000x1040.7x1240mm
设备重量: 249kgs
电源要求: 100-120V, 15Amp max or 220-240V,10Amp max, 50/69 Hz
气源要求: N/A
设备简介:The QX250i™ AOI system offers fast, flexible and high performance inspection for all applications and is ideally suited for pre-reflow and selective solder inspection. The top and bottom high-resolution Strobed Inspection Modules (SIMs) with enhanced illumination provide a single platform for the inspection and defect review process that shortens the production line and drives ~50% productivity improvement.展开更多
设备参数
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配件清单
| 规格参数 | |
|---|---|
Typical Scanning Speed | 110cm²/sec |
Minimum Component Size | 0402mm(01005inch) |
Board Length | Min.50mm(2inch)/Max.400mm(15.7inch) |
Board Width | Min.50mm(2inch)/Max.308mm(12inch) |
Board Edge Clearance (min) | 3.0mm(0.125inch)–bottom side only |
Maximum Board Weight | 3kg |
Maximum Board Warp
| Up to±7mm |
Component Types Inspected | Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header pins, and others |
Solder Joint Defects Categories | Solder bridge, opens, lifted leads, wettability, excess and in sufficient solder, debris, and others |
Other Items Detected | Gold-finger contamination, pin-in-hole, bent pins, debris, and many others |
Component Position Categories | Component X, Y position and Rotation |
| Vision System | |
|---|---|
Image Transfer Protocol | PCIe |
Lighting | Strobe White Light (with dark/bright field) |
Image Processing | Statistical Appearance Modeling (SAM™ ) Technology.
Option: Autonomous Image Interpretation (AI²) Technology |
Programming | Simple inline or offline |
CAD Import | Any column separated text file (Standard information required – ref. designator, XY, Angle, Part no.,) |
| System Specifications | |
|---|---|
Conveyor Height | Adjustable to 835–990mm(33–39inch) |
Machine Interface | SMEMA, RS232 and Ethernet |
Machine Installation | <1hour |
| Inspection Capabilities | ||
|---|---|---|
Inspection Capabilities | QX250i | QX200i |
Component Height Clearance (max) | Top:35mm,Bottom:34mm | Top:30mm,Bottom:29mm |
Imagers | 80 Megapixel Sensor
on each SIM module | 40 Megapixel Sensor on each SIM module |
Resolution | 12μm pixel size | 17μm pixel size |
| Options | |
|---|---|
SPC Software | Offline Defect Rework Station, |
Sensor Alignment Target | Barcode Readers (1D/2D) |
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