Cyberoptics （在线）SPI锡膏检查机 SE500-X
设备尺寸(W*D*H): 1340x1400x1390mm
设备重量: ≈1133kg(2498 lbs.)
电源要求: 100-130/220-240V(±10%),50/60Hz,10-15amps
气源要求: 5.6~7.0Kgf/cm²
设备简介:SE500™-X3D SPI World-Class Accuracy with Large Board Capability。
设备参数
设备文档
配件清单
| System Specifications | |
|---|---|
Panel Size Capacity (Max) | 810x610mm(32.0x24.0inch) |
Panel Size Capacity (Min) | 100x100mm(4.0x4.0inch) |
Maximum Panel Weight | 10.0kg(22lbs) |
Board Thickness | 0.5mm~6.0mm(0.02inch~0.24inch) |
Board edge clearance | Top:3.0mm(0.12inch);
Bottom:3.0mm(0.12inch) |
Component Clearance | Top(above belt):20.1mm(0.78inch);
Bottom:25.4mm(1.0inch) |
Conveyor Speed Range | 150-450mm/sec (5.9-17.7inch/sec) |
Conveyor Adjustment | Automatic |
| Functional Specifications | |
|---|---|
Maximum Inspection Area | 808x604mm(32x23.8inch) |
Field-of-View (FOV) | 32x32mm(1.26x1.26inch) |
X and Y Pixel Size @ | High Resolution:15µm(0.6mils);
High Speed:30µm(1.2mils) |
Paste Height Range | 50-500µm(2-20mils) |
Height Resolution | 0.2µm(0.008mils) |
Maximum Board Warp | <2% of PCB diagonals or max. of 6.35mm (0.25in) total |
Maximum Pad Size in FOV | 15x15mm( 0.6x0.6inch) |
Measurement Types | Height, Area, Volume, Registration, Bridge Detection, Defect Review |
Machine Interface | SMEMA, RS232 & Ethernet |
| Performance Specifications | |
|---|---|
Inspection Speed @ 30um | 108cm²/sec peak (80cm²/sec avg) |
Inspection Speed @ 15um | 65cm²/sec peak (50cm²/sec avg) |
Height Accuracy | 2µm on a Certification Target |
Gage R&R | <<5%, 6 σ on Printed Circuit Board;
<<2% 6 σ on Certification Target |
| Options | |
|---|---|
SPC software | Barcode Readers (1D/2D) |
Programming Software: ePM-SPI/AOI & GC-PowerPlace | Offline Defect Review |
Certification Target |
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