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诺信Nordson SMT自动光学检测机BX Benchtop AOI

设备尺寸(W*D*H): L991×W864×H432mm

设备重量: 77kg

电源要求: AC110-220V 50/60Hz

气源要求:

设备简介:诺信Nordson YESTECH BX,台式(Benchtop)离线AOI,面向小批量多品种、研发与返修工位:5MP彩色相机+专有Fusion Lighting,可选4个侧视相机,编程约30分钟,程序与YESTECH在线FX系列兼容。官方datasheet:34×39×17in(864×991×432mm,W×D×H)、170lbs(77kg)、110-220VAC 50/60Hz 10A、无需气源。平台原尺寸按W×D×H记录且气源为NA,本次按L×W×H重排并删除气源字段。展开更多

设备参数
设备文档
配件清单

设备参数

Inspection Capabilities
Throughput
Up to 10 sq. in./sec. > 500,000 components per hour
Maximum Board Size
457mmx508mm
Clearance
50mm top and 50mm bottom
Minimum Component Size
0201; 01005 with high magnification option
Defects Detected
Part: position, missing, wrong, polarity, skew, tombstone Lead: bent, lifted, bridging Solder: open, insufficient, short, solder balls
Software
Algorithms
Color, OCV, OCR, barcode recognition, both image and rule-based algorithms
Data Requirements
ASCII Text, X-Y position, part , ref, polarity
CAD Translation Package
Aegis, Unicam, Fabmaster, YESTECH CAD Utility
Programming Skill Level
Technician or operator
Operating System
Windows 7
Off-line Software
Optional : Rework, Review and Program Creation
SPC Software
Optional : Real-time local and remote monitoring of first pass yield, defect trends, and machine utilization
Data Outputs
Text, SQL, ODBC, MS Access
Hardware
Lighting
Proprietary Fusion Lighting™ multiangle LED
Imager
5 megapixel color camera Resolution 2448 x 2048; 25, 12 or 8 micron pixel size

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