诺信 Nordson SMT自动光学检查机 BX Benchtop AOI
设备尺寸(W*D*H): 864mmx991mmx432mm
设备重量: 77kg
电源要求: 110-220 VAC, 50/60 Hz, 10 amps
气源要求: NA
设备简介:Programming the BX is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder inspection. The BX utilizes a standard package library to simplify training and ensure program portability across manufacturing lines. Programs created with the BX are also compatible with Nordson YESTECH’s complete line of AOI systems.展开更多
设备参数
设备文档
配件清单
| Inspection Capabilities | |
|---|---|
Throughput | Up to 10 sq. in./sec. > 500,000 components per hour |
Maximum Board Size | 457mmx508mm |
Clearance | 50mm top and 50mm bottom |
Minimum Component Size | 0201; 01005 with high magnification option |
Defects Detected | Part: position, missing, wrong, polarity,
skew, tombstone
Lead: bent, lifted, bridging
Solder: open, insufficient, short, solder balls |
| Software | |
|---|---|
Algorithms | Color, OCV, OCR, barcode recognition, both image and
rule-based algorithms |
Data Requirements | ASCII Text, X-Y position, part , ref, polarity |
CAD Translation Package | Aegis, Unicam, Fabmaster, YESTECH CAD Utility |
Programming Skill Level | Technician or operator |
Operating System | Windows 7 |
Off-line Software | Optional :
Rework, Review and Program Creation |
SPC Software | Optional :
Real-time local and remote monitoring of first
pass yield, defect trends, and machine utilization |
Data Outputs | Text, SQL, ODBC, MS Access |
| Hardware | |
|---|---|
Lighting | Proprietary Fusion Lighting™ multiangle LED |
Imager | 5 megapixel color camera
Resolution 2448 x 2048; 25, 12 or 8 micron pixel size |
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