设备尺寸(W*D*H): 1000mmx1329mmx1531mm
设备重量: 950 lbs (430 kg)
电源要求: 110-220VAC, 50/60 Hz, 15 amps
气源要求: 60 PSI min., 1/4” air hose, 2 CFM
设备简介:Nordson YESTECH’s advanced 3D imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top down viewing camera, four side viewing cameras and 2D + 3D inspection, the FX-940 ULTRA inspects solder joints and verifies correct part assembly enabling users to improve quality and increase throughput展开更多
Specifications | |
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Throughput | 130 cm² /sec (2D)
60 cm² /sec (3D) |
Maximum Board Size: | 698mmx559mm |
Maximum Inspection Area | 571mmx470mm |
Clearance | 50mm top
100mm bottom |
Minimum Component Size | 008004 with high magnification sensor option |
False Calls | <500 PPM (<0.05% typical) |
Defects Detected | Part: shifted, missing, wrong, polarity, skew
tombstone, HiP, tilt, flip, billboard
Lead: bent, lifted, bridging
Solder: open, insufficient, short, solder balls
Other: FOD, SPI |
Softwar | |
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Algorithms | 3D body (x,y,z, theta, tilt), 3D solder profile, part, height,
part coplanarity, 3D lead inspection, color, OCR, OCV
barcode (1D & 2D), histogram, blob analysis, edge detection |
Data Requirements | ASCII Text, X-Y position, part , ref, polarity |
CAD Translation Package | Aegis, Unicam, Fabmaster, YESTECH CAD Utility |
Off-line Software | Optional :
Rework, Review and Program Creation |
SPC Software | Optional :
Real-time local and remote monitoring of first |
Data Outputs | Text, SQL, ODBC, MS Access |
Hardware | |
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Material Handling | SMEMA, dual direction auto width conveyor,
pass / fail signals, board clamping |
Lighting | Multi-axis 4 phase LED |
Conveyor | Dual lane conveyor, heavy duty chain conveyor,
large board option up to 1.5m |
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