参数 | |
---|---|
Core Cycle Time | 7.0 secs + process |
Operating System | Windows 10 IoT Enterprise |
Printer Construction | One piece optimised welded frame |
Substrate Thickness | 0.2mm to 6mm |
Substrate Weight (maximum) | 1kg |
Substrate Underside Clearance | Programmable 3mm to 42mm |
Print Pressure | 0kg to 20kg |
Print Speed | 2mm/sec to 300mm/sec |
Print Gap | 0mm to 6mm |
Substrate Separation | Speed: 0.1mm/sec to 20mm/sec Distance: 0mm to 20mm |
Substrate Handling Size (minimum) | 50mm (X) x 40.5mm (Y) |
Substrate Handling Size (maximum) | 510mm (X) x 508.5mm (Y) |
Substrate Length (Three Stage Mode) (maximum) | 370mm (X) |
Machine Alignment Capability | > 2.0 Cmk @ +/- 12.5µm, (±6 Sigma) |
System Alignment Capability | > 2.0 Cmk @ +/- 20µm, (±6 Sigma) |
Wet Print Capability | > 2.0 Cpk @ +/- 25µm, (±6 Sigma) |
Temperature | 10° to 35°C |