参数
Core Cycle Time	7.0 secs + process
Operating System	Windows 10 IoT Enterprise
Printer Construction	One piece optimised welded frame
Substrate Thickness	0.2mm to 6mm
Substrate Weight (maximum)	1kg
Substrate Underside Clearance	Programmable 3mm to 42mm
Print Pressure	0kg to 20kg
Print Speed	2mm/sec to 300mm/sec
Print Gap	0mm to 6mm
Substrate Separation	Speed: 0.1mm/sec to 20mm/sec Distance: 0mm to 20mm
Substrate Handling Size (minimum)	50mm (X) x 40.5mm (Y)
Substrate Handling Size (maximum)	510mm (X) x 508.5mm (Y)
Substrate Length (Three Stage Mode) (maximum)	370mm (X)
Machine Alignment Capability	> 2.0 Cmk @ +/- 12.5µm, (±6 Sigma)
System Alignment Capability	> 2.0 Cmk @ +/- 20µm, (±6 Sigma)
Wet Print Capability	> 2.0 Cpk @ +/- 25µm, (±6 Sigma)
Temperature	10° to 35°C