配备有可提高小型芯片元件贴装性能的转塔式贴装头。继承了“单一贴装头解决方案”的特长，无需更换贴装头，在保持高速性的状态下可支持范围广泛的元件贴装，从超小型芯片元件到中型、异形元件，均可对应。

A dual-lane surface mounter delivering great productivity, flexibility and ability to take on PCB. 1 head solution provides broad-range production capability Solution for variable-mix, variable volume production High accuracy mounting and steady production of micro components High-efficiency production with various features